MediaTek has recently announced a trio of new chipsets to join their Dimensity family: the Dimensity 7400, 7400X, and 6400. These chipsets offer exceptional experiences for high-tech and mainstream mobile devices, complementing the existing flagship and premium offerings of the Dimensity 9400 and 8400.
Dimensity 7400 and 7400X are designed to deliver advanced gaming and AI camera technology to consumers. They integrate an octa-core CPU with 4X Arm Cortex-A78 cores operating up to 2.6GHz and 4X Arm Cortex-A55 cores up to 2.0GHz, plus an Arm Mali-G615 MC2 GPU. Built on TSMC’s 4nm process node, these chipsets are super efficient, using between 14% to 36% less power when gaming than competitive chipsets.
These SoCs also feature MediaTek Advanced Gaming Technology (MAGT) 3.0, which supports improved graphics performance, AI optimizations that adjust game settings based on the device’s workload, reduced input lag for quicker response, and advanced power savings to enjoy longer gaming sessions.
On the other hand, the Dimensity 6400 focuses on providing fantastic performance and enhanced 5G in an accessible package. It utilizes an octa-core CPU with 2X Arm Cortex-A76 cores operating up to 2.5GHz and 6X Arm Cortex-A55 cores up to 2.0GHz, plus an Arm Mali-G57 MC2 GPU. Built on TSMC’s 6nm process node, the Dimensity 6400 is also very power efficient, using up to 19% less power when gaming than competitive chipsets.
One of the key features of the Dimensity 6400 is the MediaTek Bluetooth Wi-Fi HyperCoex Technology, which reduces gaming latency by up to 90% for a smoother gaming experience. It also boasts a Release 16 Sub-6 5G Modem that supports 2CC-CA for improved connectivity, offering up to 33% faster downlink and 18% faster uplink speeds than competitors.
The Dimensity 6400 also enables billion-color displays with authentic 10-bit images and videos for vivid visuals and supports True Color Accuracy for improved color correction, generating more accurate and lifelike visuals. Additionally, it supports 108MP camera sensors enhanced with MediaTek and Arcsoft’s multi-frame noise reduction (MFNR) and low pass noise reduction (LPNR) for sharper selfies and portraits.
The first smartphones powered by the MediaTek Dimensity 7400 and 7400X are expected to be available in Q1 2025, while the Dimensity 6400 is currently available.
Visit www.mediatek.com for more information.