Extreme Performance and Efficiency for the Latest AI Experiences
MediaTek has just launched its new flagship smartphone chipset, the Dimensity 9400. This chipset is optimized for edge-AI applications, immersive gaming, incredible photography, and more. The Dimensity 9400 offers a massive boost in performance with its second-generation all-big-core design built on Arm’s v9.2 CPU architecture, combined with the most advanced GPU and NPU for extreme performance in a super power-efficient design.
Key Features and Benefits
- Second-Generation all-big-core Design: The Dimensity 9400 adopts MediaTek’s second-generation all-big-core design, integrating one Arm Cortex-X4 core operating over 3.62GHz with 3x Cortex-X4 and 4x Cortex-A720 cores. This design offers 35% faster single-core performance and 28% faster multi-core performance compared to MediaTek’s previous-generation flagship chipset, the Dimensity 9300.
- Power Efficiency: Built on TSMC’s second-generation 3nm process, the Dimensity 9400 is up to 40% more power-efficient than its predecessor, allowing users to enjoy longer battery life.
- Exceptional Generative AI Performance: The Dimensity 9400 boasts several industry firsts for exceptional generative AI performance. It is the first mobile chipset to offer on-device LoRA training, high-quality on-device video generation, and developer support for Agentic AI.
- Immersive Gaming Experiences: The 12-core Arm Immortalis-G925 delivers super immersive gaming experiences with up to 40% faster raytracing performance than the previous generation.
- Enhanced Photography Capabilities: With MediaTek Imagiq 1090, the Dimensity 9400 provides HDR video recording throughout the entire zoom range so users can snap the perfect moment from a distance. MediaTek’s Smooth Zoom technology also makes it easy to capture moving subjects.
Other Notable Features
- A refreshed 3GPP Release-17 5G modem with 4CC-CA and up to 7Gbps sub-6GHz performance.
- The new 4nm Wi-Fi/Bluetooth combo chip has 7.3Gbps data rate performance and up to 50% lower power consumption compared to the previous generation.
- Support for Wi-Fi 7 tri-band MLO.
- MediaTek Xtra Range™ 3.0, which delivers up to 30m greater Wi-Fi coverage.
- 5G/4G Dual SIM Dual Active, Dual Data capabilities to give users more flexibility.
- Support for tri-fold smartphones gives smartphone makers the flexibility to design innovative new form factors.
Overall, the MediaTek Dimensity 9400 is a powerful and efficient chipset with several improvements over its predecessor. It is well-suited for various applications, including AI, gaming, and photography.
Some of the key specifications from the page include:
CPU:
- 1x Arm Cortex-X925, 2MB L2 cache, up to 3.63 GHz
- 3x Arm Cortex-X4, 1MB L2 cache
- 4x Arm Cortex-A720, 512KB L2 cache
- 12MB L3 cache
- 10MB SLC
GPU:
- Arm Immortalis-G925 MC12
- Video
- 8K60, 10-bit Video Decode (HEVC/AVC/VP9/AV1)
- 8K30, 10-bit Video Encode (HEVC/AVC)
- 8K60, 8-bit HEVC Encode
AI:
- AI Processing Unit: MediaTek APU 890 (Generative AI, Agentic AI)
Connectivity:
- 5G Modem: 3GPP Release-17 5G modem with support for Sub-6GHz (FR1) and 5G-CA
- Wi-Fi: New 4nm Wi-Fi 7/Bluetooth chip with Wi-Fi 7 (a/b/g/n/ac/ax/be) and up to 7.3Gbps data rate
- Bluetooth: 5.4 with dual Bluetooth engine and up to 12Mbps data rate, 24bit/384KHz BT Audio
Camera:
- Max Camera Sensor Supported: 320MP
- Max Video Capture Resolution: 8K60 (7690 x 4320)
Display:
- Max Refresh Rate: WQHD+ 180Hz
- Display Support: Tri-port MIPI for Tri-Fold Displays
Other:
- Memory: LPDDR5X memory with up to 10667 Mbps frequency
- Storage: UFS 4 + MCQ storage
- Video: 8K60 video decode (HEVC/AVC/VP9/AV1) and 8K30 video encode (HEVC/AVC)
This information provides a good overview of the MediaTek Dimensity 9400’s capabilities, highlighting its strengths in AI processing, connectivity, camera support, and display technology.
The first smartphones powered by the MediaTek Dimensity 9400 will be available in the market starting in Q4 of 2024.
Source MediaTek